NHANCED SEMICONDUCTORS, INC.

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Arclight Demo Aerospace & Defense, Inc.

UEI DEMOPRIMEC01 · CAGE 0DEMO · Prime Corporate

CMMC Level 2 (C3PAO)
6 contract vehicles
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Arclight Demo Aerospace & Defense, Inc.

UEI DEMOPRIMEC01 · CAGE 0DEMO · Prime Corporate

CMMC Level 2 (C3PAO)
6 contract vehicles
Case studies & key people
Photo gallery & brand

See the finished profile Download it as an AI-ready Markdown file

A fictional company, built to show every section filled in.

Looking for something specific? Tour the demo profile

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NHANCED SEMICONDUCTORS, INC. — UEI LATHGF1NRTC1 | TeamingIndex

Proven teaming graph

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Who NHANCED SEMICONDUCTORS, INC. has actually worked with, from sub-awards that prime contractors report to the government. Use it to see which primes already trust this company.

Primes it has worked under

SRI INTERNATIONAL
UEI SRG2J1WS9X63
$1.1M
Subcontractor to this prime · 1 sub-award · latest Mar 12, 2025
- Defense Advanced Research Projects Agency
- “DEVELOP AND EXECUTE PROCESSES FOR THE ALIGNMENT AND BONDING OF PHOTONIC INTEGRATED CIRCUIT CHIPS TO SUPPORT THE GOALS OF HAPPI IN INTEGRATING FOUR DISCRETE PIC CHIPS WITH OPTICAL INTERCONNECTS BETWEEN THEM.”
LOCKHEED MARTIN ACULIGHT CORPORATION
UEI WYAVK6MSRJ15
$641.5K
Subcontractor to this prime · 1 sub-award · latest Mar 19, 2024
- Defense Advanced Research Projects Agency
- “SERVICE ITEM”
RAYTHEON COMPANY
UEI LWF3QUSCDNG1
$383.7K
Subcontractor to this prime · 1 sub-award · latest Feb 26, 2026
- Department of the Navy
- “HYBRID,ASIC&MCM MATL.”
NORTH CAROLINA STATE UNIVERSITY
UEI U3NVH931QJJ3 · not in the directory yet
$381.7K
Subcontractor to this prime · 1 sub-award · latest May 14, 2025
- Defense Advanced Research Projects Agency
- “DEVELOP AND EXECUTE PROCESSES FOR THE ALIGNMENT AND BONDING OF PHOTONIC INTEGRATED CIRCUIT CHIPS TO SUPPORT THE GOALS OF HAPPI IN INTEGRATING TWO DISCRETE PIC CHIPS WITH OPTICAL INTERCONNECTS BETWEEN THEM.”
CALIFORNIA INSTITUTE OF TECHNOLOGY
UEI U2JMKHNS5TG4
$311.5K
Subcontractor to this prime · 2 sub-awards · latest Sep 11, 2026
- National Aeronautics and Space Administration
- “TO PERFORM OXIDE-OXIDE BONDING OF WAFERS AND BACKTHINNING OF THE DEVICES TO A SPECIFIED THICKNESS.”
- “SEMICONDUCTOR ADVANCED PACKAGING”
HRL LABORATORIES, LLC
UEI CCBKQV2MBMV6
$148.5K
Subcontractor to this prime · 1 sub-award · latest Jul 18, 2025
- Department of the Navy
- “WAFER FABRICATION”

Subcontractors it has used

No reported sub-awards as a prime contractor.

Source: USAspending.gov sub-award reports (FSRS) (opens in a new tab) · as of Nov 9, 2026 · Prime contractors report first-tier subcontracts of $30,000 or more. Amounts are reported sub-award values.

SBIR/STTR portfolio

Learn more About SBIR/STTR

Small Business Innovation Research and Technology Transfer awards: early-stage federal R&D money this company has won.

SBIR/STTR awardee — Phase III-eligible for work derived from its SBIR/STTR projects

Agencies may award follow-on Phase III work without a new competition when it builds on this company’s earlier SBIR/STTR projects. Other work is competed as usual.

Awards on record: 21 awards
Total awarded: $9,451,098
By phase: SBIR Phase I: 13
SBIR Phase II: 7

FedRAMP offerings

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Cloud services this company lists on the FedRAMP Marketplace, the government's record of cloud authorizations.

No FedRAMP Marketplace listing

No FedRAMP Marketplace listing is linked to this company. Cloud providers appear here automatically once FedRAMP lists their offering.

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Source: FedRAMP Marketplace · sync date not recorded

Exclusions & screening

Exclusions Screening list

Checks a prime runs before teaming: SAM.gov exclusions (debarment and suspension) and the government's Consolidated Screening List for export and sanctions lists.

SAM.gov exclusions

Not yet checked against SAM.gov exclusions.

Search exclusions on SAM.gov (opens in a new tab)

Agencies generally may not award to excluded parties, and primes may not subcontract with them above the threshold in FAR 52.209-6 (except COTS items) without a compelling reason reported to the contracting officer (FAR 9.405, 9.405-2). Some exclusion types apply only to specific programs: read the record on SAM.gov.

GSA CALC+ rate benchmark

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Hourly ceiling rates this company was awarded on GSA contracts, compared with the market for similar labor categories. Ceiling rates are the most an agency can be charged, not prices paid.

No GSA CALC+ rates on record

Companies with a GSA Multiple Award Schedule contract appear here after CALC+ publishes their awarded labor rates.

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Source: GSA CALC+ awarded ceiling rates · sync date not recorded

Awards (most recent first)

CMOS Integrated With Float Zone Pixel Sensor
SBIR Phase II · Department of Energy · 2021 · $1,099,793
May 3, 2021 – May 2, 2023
Solicitation year 2021 · Topic 32c
Micro-Transfer-Printing Of Repeaters On Passive Interposer
SBIR Phase I · Department of Energy · 2021 · $200,000
Feb 22, 2021 – Nov 22, 2021
Solicitation year 2021 · Topic 36d
Energy-Efficient Reconfigurable Universal Accelerator Interconnect
SBIR Phase II · Department of Energy · 2020 · $1,499,914
Apr 6, 2020 – Apr 5, 2022
Solicitation DE-FOA-0002155 (2020) · Topic 05a
CMOS Integrated With Float Zone Pixel Sensor
SBIR Phase I · Department of Energy · 2020 · $199,904
Feb 18, 2020 – Nov 17, 2020
Solicitation DE-FOA-0002145 (2020) · Topic 32c
8k x 8k Delta Doped 3D Advanced Hybrid Detector Prototype For UV
SBIR Phase I · National Aeronautics and Space Administration · 2019 · $124,694
Aug 19, 2019 – Feb 18, 2020
Solicitation SBIR_19_P1 (2019) · Topic S1
A New Cost-Effective Engineered Substrate
SBIR Phase I · Department of Energy · 2019 · $199,031
Jul 1, 2019 – Mar 31, 2020
Solicitation DE-FOA-0001941 (2019) · Topic 30b
Energy-Efficient Reconfigurable Universal Accelerator Interconnect
STTR Phase I · Department of Energy · 2019 · $224,868
Feb 19, 2019 – Feb 18, 2020
Solicitation DE-FOA-0001940 (2019) · Topic 05a · Research partner: University of California, Davis
Copper Nano-TSVs for 3D Integrated Sensors
SBIR Phase I · Department of Energy · 2019 · $149,931
Feb 19, 2019 – Nov 18, 2019
Solicitation DE-FOA-0001940 (2019) · Topic 29d
An Active Pixel Sensor Fabricated Using 5mm Thick Si Wafer Material
SBIR Phase I · Department of Energy · 2018 · $149,663
Jul 2, 2018 – Apr 1, 2019
Solicitation DE-FOA-0001771 (2018) · Topic 01a
Development of Designs, Processes and Technology for 200mm Silicon Sensors
SBIR Phase II · Department of Energy · 2016 · $999,961
Aug 1, 2016 – Jul 31, 2018
Solicitation DE-FOA-0001490 (2016) · Topic 30f
64MB+ Radiation-Hardened, Non-Volatile Memory for Space
SBIR Phase II · Department of Defense (Air Force) · 2015 · $746,088
Jun 22, 2015 – Jul 21, 2017
Solicitation 2014.1 (2015) · Topic AF141-250
Development of Designs, Processes and Technology for 200mm Silicon Sensors
SBIR Phase I · Department of Energy · 2015 · $149,777
Jun 8, 2015 – Mar 7, 2016
Solicitation DE-FOA-0001227 (2015) · Topic 30f
64MB+ Radiation-Hardened, Non-Volatile Memory for Space
SBIR Phase I · Department of Defense (Air Force) · 2014 · $149,257
Jun 30, 2014 – Mar 30, 2015
Solicitation 2014.2 (2014) · Topic AF141-250 · Research partner: Stub
Next Generation Rad Hard Reduced Instruction Set Computer
SBIR Phase I · Department of Defense (Air Force) · 2014 · $149,611
Jun 20, 2014 – Mar 2, 2015
Solicitation 2014.1 (2014) · Topic AF141-097 · Research partner: Stub
Radiation-Hardened, Resistive Random Access Memory
SBIR Phase II · Department of Defense (Air Force) · 2012 · $749,919
Started Aug 15, 2012
Solicitation 2010.3 (2010) · Topic AF103-093 · Research partner: Stub
Radiation-Hardened, Resistive Random Access Memory
SBIR Phase I · Department of Defense (Air Force) · 2011 · $99,997
Started Feb 18, 2011
Solicitation 2010.3 (2010) · Topic AF103-093 · Research partner: Stub
Design and Fabrication Techniques for 3-Dimensional Integrated Circuits
SBIR Phase I · Department of Defense (Defense Advanced Research Projects Agency) · 2009 · $98,955
Dec 29, 2009 – Aug 30, 2010
Solicitation 2009.1 (2009) · Topic SB091-008
Ultra-Dense Three-Dimensional Electronics for Space
SBIR Phase II · Department of Defense (Air Force) · 2009 · $679,805
Aug 26, 2009 – Oct 31, 2011
Solicitation 2007.3 (2007) · Topic AF073-099
3-D Space Qualifiable Field Programmable Gate Array
SBIR Phase I · Department of Defense (Air Force) · 2009 · $100,000
Feb 13, 2009 – Jan 13, 2010
Solicitation 2008.3 (2008) · Topic AF083-208
Ultra-Dense Three-Dimensional Electronics for Space
SBIR Phase II · Department of Defense (Air Force) · 2009 · $1,579,930
Dec 23, 2008 – Jan 29, 2010
Solicitation 2007.3 (2007) · Topic AF073-099
Ultra-Dense Three-Dimensional Electronics for Space
SBIR Phase I · Department of Defense (Air Force) · 2008 · $100,000
Jan 15, 2008 – Jan 15, 2009
Solicitation 2007.3 (2007) · Topic AF073-099

Compliance posture: unverified (SAM.gov baseline only)

About NHANCED SEMICONDUCTORS, INC.

Identifiers

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Capabilities & differentiators

Compliance posture

Facility clearance

Past performance

Contract vehicles

Proven teaming graph

Primes it has worked under

Subcontractors it has used

SBIR/STTR portfolio

FedRAMP offerings

Exclusions & screening

SAM.gov exclusions

GSA CALC+ rate benchmark

NAICS, PSC & socio-economic status

Teaming preferences

Business development contact

Corporate hierarchy

Data sources & provenance

Consolidated Screening List